During the AMD Keynote at Computex 2022, CEO Dr. Lisa Su officially revealed the next generation of Ryzen processors and the successor to the highly successful Ryzen 5000 series. The new family, the Ryzen 7000 series, will feature up to 16 Zen 4 cores using TSMC’s improved 5nm manufacturing process.
The AMD Ryzen 7000 also officially marks the end of the long-running AM4 socket, with it replaced by the new AM5 LGA1718 socket with a newly announced trio of new performance-driven chipsets, including the X670E, X670, and B650.
AMD Ryzen: A Brief Summary of Five Years of Revitalizing the Desktop
Since AMD’s original Ryzen (Zen) debuted in 2017, AMD has constantly innovated and developed its infrastructure in a way that no one but AMD itself thought was possible before Zen. Some of the major developments that came with Zen included the new AM4 socket, which is undoubtedly one of the most successful sockets in its history and brought DDR4 memory to the mainstream market. In 2018, AMD shipped its updated Zen+ microarchitecture with Ryzen 2000, based on GlobalFoundries’ more efficient and improved 12nm architecture, along with a marked increase in IPC performance gains to boot.
Moving forward into 2019, AMD debuted the Zen 2 architecture, which was used as the basis for its Ryzen 3000 series of CPUs. By switching to TSMC’s high-performance 7nm manufacturing process, AMD delivered even higher levels of Zen/Zen+ performance, with double-digit gains in IPC performance and an entirely new design transformation through the use of chiplets.
This continued into 2020 when AMD began shipping Zen 3 with massive gains on Zen 2, with up to 19% gains in IPC over Zen 2, as well as offering Resizable BAR, and higher levels of L3 cache than ever before. and the introduction of PCIe 4.0 to the desktop.
AMD Ryzen 7000: Bringing Zen 4 and 5 nm to the consumer desktop
The AMD Ryzen 7000 family, the latest in AMD’s arsenal, and perhaps one of the most anticipated processor announcements of the year, has finally been announced, with some new features designed to deliver a premium desktop experience. We have known for a long time that a file Zen 4 microarchitecture is based on an improved 5nm TSMC the manufacturing process, but we haven’t learned some intricate details yet.
Although the 5nm TSMC manufacturing process was initially found in smartphones, with both Apple and Huawei supporting the transition, Zen 4 represents the first use of 5nm for desktop systems. AMD Ryzen 7000 and Zen 4 are similar to Zen 3, including the chip-based design, with two core complex die (CCD) cores based on the TSMC 5nm manufacturing process.
While AMD doesn’t go into great detail about the architecture of the Zen 4 today — they should save something to explore later in the year — for now, the company reveals that the Zen 4 will come with 1MB of L2 cache per CPU core. , which is twice the size of the L2 cache found in Zen 3 (and Zen 2) CPU cores. In the meantime, the L3 cache will remain a theme for another day; AMD isn’t providing details about its L3 cache or whether we’ll see Zen 4 models with their stacked 3D V-cache.
Besides optimizing the L2 cache, AMD aims for higher clock speeds, thanks to its architecture and TSMC’s 5nm process. Officially, the company is only claiming max “5GHz+” turbo speeds at the moment, but in a demonstration video shown by Dr. 5 GHz for current AMD Ryzen 5000 desktop chips.
As a result of these cache, architecture (IPC) and clock speed improvements, AMD is touting a more than 15% increase in single-thread performance. And checking AMD’s disclosure notes, this is based on early Cinebench R23 notes, which compare the pre-production 16C Ryzen 7000 chip to the 16C 5950X chip. Due to the significant clock speed increases that AMD demonstrated on this chip, this means that most of AMD’s performance improvements come from clock speed improvements rather than the IPC raise. However, Cinebench is a single standard, and at the moment we don’t have any additional information about the major architectural changes that AMD has made.
Although AMD reveals that the Zen 4 / Ryzen 7000 is receiving AI acceleration instructions. Like many other aspects of the chip, more details will come, but AMD seems to be adding some guidelines for data processing using popular AI data formats like bfloat16 and int8/int4.
For the Ryzen 7000, AMD is also introducing a new 6nm input/output (IOD) card, which replaces the 14nm IOD used in previous Zen 3 designs. Representing a first for AMD, the new IOD includes an iGPU, in this case based on AMD’s RDNA2 architecture. So with the Ryzen 7000 generation, all of AMD’s CPUs will technically be APUs too, with graphics being an essential part of building the chip. What this means for the future of monolithic desktop APUs from AMD is uncertain, but at least, it means that all (or nearly all) AMD CPUs will be suitable for use in systems without discrete graphics, which although not Huge deal for consumer systems, pretty much a big deal for corporate/commercial systems.
The new IOD also gives AMD the opportunity to realize some significant platform power savings. Not only is TSMC’s 6nm process ahead of GlobalFoundries’ legacy 14nm process, but the design process has allowed AMD to incorporate many of the power-saving technologies first developed for the Ryzen 6000 Mobile series, such as additional and active low-power cases. Energy management capabilities. As a result, the Ryzen 7000 should perform much better on idle workloads and low usage, and it’s a reasonable assumption to see IODs consuming less power on load, too (at least with graphics disabled). Despite the full load, with up to 16 cores running at over 5GHz, CCDs still consume quite a bit of power.
On the power issue, it’s also worth noting that AMD reports that the Ryzen 7000 will run at higher TDPs. While AMD doesn’t announce official SKUs at this point, it does state explicitly that the new AM5 platform allows TDPs (CPU Packet Power) up to 170W in this generation, which is higher than the 105W TDPs of the AM4-based Ryzen 5000 series. .
Last, but not least, AMD’s Zen 4 microarchitecture along with the new IOD also brings a host of new features, including official support for PCIe 5.0, just like Intel introduced with the Alder Lake (12th Gen Core) architecture. . The combination of the AMD Ryzen 7000 and the X670E, X670, or B650 motherboard will provide up to 24 PCIe 5.0 slots split between slots and storage devices, with support for up to 14 USB ports, native MAC support for Wi-Fi 6E, as well as the ability to provide Up to four display outputs including HDMI 2.1 and DisplayPort 2.
AMD’s Socket AM5: LGA1718 with three new chipsets, X670E, X670, and B650
As the announcement of the AMD Ryzen 7000 family of processors officially ends the previous AM4 socket, AMD has also revealed details surrounding the new AM5 socket, also known as the LGA1718 socket. The AMD AM5 socket will have 1,718 pins connecting the processor to the motherboard socket, although AMD has not provided any information regarding the pin layout.
One of the interesting things we already mentioned is that the AMD Ryzen 7000 will be moving to support processors up to 170W on the Zen 4, as opposed to the 105W TDP found in processors like AMD’s previous Ryzen 9 5950X. AMD is also using a new heat spreader (IHS) design on the Ryzen 7000, which AMD did to allow compatibility with earlier socket AM4 coolers. This means that, in theory, users looking to upgrade to the Ryzen 7000 will be able to use pre-existing coolers with socket AM4 support.
The AM5 socket and Ryzen 7000 also bring PCIe 5.0 to the table, with many storage vendors expecting to announce a new wave of PCIe 5.0 storage devices designed to take advantage of all that extra bandwidth compared to PCIe 4.0. Meanwhile, we’ve seen Intel introduce DDR5 memory to desktop PCs with its 12th Gen Core series, although Intel offers support for both DDR5 and DDR4 memory. AMD is also using DDR5 going forward, but it looks like they won’t be using DDR4 memory, or at least offering DDR4 support initially for their premium chipsets.
Besides announcing the Ryzen 7000 family and its Zen 4 microarchitecture, AMD also announced three new chipsets for the AM5, X670E, X670, and B650. Starting with the flagship X670E “Extreme” chipset, it’s built for its most premium models, focusing on extreme overclocking, with full PCIe 5.0 support. The X670E and X670 cater to both enthusiasts, with support for PCIe 5.0 graphics, upcoming PCIe 5.0 storage hardware, and dual-channel DDR5 memory support.
AMD hasn’t announced the full range of DDR5 support yet, such as top speeds or the level of JEDEC support, but we expect to find out more from AMD and motherboard vendors over the coming months. AMD mentioned that Socket AM5 features a new SVI Gen 3 power infrastructure, but it didn’t go into the technical specifications. AMD claims that this will enhance support for additional power phases, precise power control, and faster power response capabilities.
Interestingly, AMD differentiates the X670 into two market segments compared to previous versions such as the X570, X470, and X370. It looks like more premium models like the ASUS ROG Crosshair series, MSI’s MEG series, and GIGABYTE’s Aorus Xtreme series will rely on the X670E to separate it from the more focused, mid-range and widely affordable X670 options.
The B650 chipset, as with previous AMD B-series sockets, will target mainstream users with more affordable options that feature PCIe 5.0 storage and support for dual-channel DDR5 memory like the X670E and X670 chipsets.
It also remains unclear if AMD intends to release its A-series AM5 chipset yet for budget-conscious users who want the power of AMD 5nm Zen 4 cores but without the fancy demands that PCIe 5.0 brings to the table.
Along with the announcement of the X670E, X670, and B650 chipsets, AMD has announced some premium models we can expect to see when the Ryzen 7000 launches. This includes a range of flagship and premium X670E models from our families that have been seen many times before on AM4 chips. Current and Intel chipset options.
Some of the models announced during the AMD Computex 2022 Keynote include ASRock X670E Taichi motherboards, ASUS ROG Crosshair X670E Extreme, Biostar X670E Valkyrie, GIGABYTE X670 Aorus Xtreme, and MSI MEG X670E Ace motherboards.
We do not have any official specifications from motherboard vendors regarding the announced models at the time of writing. However, we expect to start receiving specifications, console kits, and power delivery information very soon.
AMD Ryzen 7000 Processors: Coming in Fall 2022
Although AMD primarily opted for the paper launch of its latest Ryzen 7000 family of processors, it hasn’t actually provided any details regarding the SKUs or expected pricing. From AMD Keynote during Computex 2022 hosted by CEO Dr. Lisa Su, we know that AMD plans to introduce the Ryzen 7000 with up to 16 cores, but it remains to be seen if AMD goes for more cores in the coming months.
We know that in AM4 during the 2017 to 2020 progression of AMD’s Ryzen family, Zen initially came with 8C/16T options (Ryzen 7 1800X), while we saw AMD double that capacity with 16C/32T options like the Ryzen 9 3950X.
It remains to be seen if we’ll see a Ryzen 7000 with more 16C models, but for now, that’s what AMD is committed to, at least for Computex 2022. AMD said we’ll get more information about the Ryzen 7000 family of processors, Zen 4 and Socket AM5 in the coming months as we head toward a full retail launch in the fall of 2022.
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